Copper/Nickel filler conductive adhesive
Silver migration and galvanic corrosion prevention for bonding aluminum and copper electrodes.
Conductive adhesive that does not use conventional silver fillers For high-temperature and high-humidity applications concerned about silver migration For conductive adhesion to aluminum where galvanic corrosion is a concern For electrode adhesion of FPC (Flexible Printed Circuit)
- Company：理経
- Price：Other
